Friday, May 21Sony announces important milestone for their new fab in the Nagasaki Prefecture, Japan.
Sony announced today that their brand new manufacturing plant in the Nagasaki Prefecture ( Nagasaki #2 ) is indeed ready for sample production of CELL based chips using 300 mm silicon wafers ( the diameter of the wafer measures 300 mm ): low yelds, mostly needed to test the new 65 nm manufacturing process co-developed with Toshiba and to debug the design of these early CELL based processors. This follows a past announcement regarding their Semiconductors investment strategy:
Sony announces investment in Semiconductors Sony also announced that the first CELL chips should come from IBM\'s East Fishkill fab on which Sony has invested almost $318 Million for new 65 nm lines and equipment for 300 mm silicon wafers as announced in this statement:
Sony announces Semiconductor investmentThe Nagasaki #2 announcement comes a few months after the news that Toshiba has completed construction of their new fab in the Oita Prefecture ( Oita #2 ), which is being co-financed by Sony Computer Entertainment ( SCE ):
Toshiba announces completion of Oita #2. This new fab (Oita #2) will also have 65 nm equipment and will use 300 mm silicon wafers and will host production of several LSI circuits including CELL based chips.